BSPDN + more things

Published: December 12, 2022 (Updated: January 16, 2023) in business | 商業 | 상업 | ビジネス, china | 中國 | 중국 | 中華, economics | 經濟學 | 경제학 | 経済, energy | 能源 | 에너지 | エネルギー, ethics | 倫理 | 윤리학, health | 衛生保健 | 보건 의료, hong kong | 香港 | 홍콩 | 香港, ideas | 想法 | 생각 | 考える, innovation | 革新 | 독창성 | 改変, japan |日本 | 일본, online | 線上 | 온라인으로 | オンライン, security | 保衛 | 정보 보안 | 情報セキュリティー, taiwan | 中華民國 | 중화민국 | 民国, tools | 工具 | 도구 | ツール, web of no web | 無處不在的技術 | 보급 기술 | 普及したテクノロジー by renaissance chambara aka Ged Carroll.

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IEDM: DTCO & More than Moore – by Doug O’Laughlin – The future is about Design Technology Co-optimization (DTCO), and Backside Power Deliever Networks (BSPDN) is a huge part of the roadmaps forward post-gate-all-around. A good place to start on what exactly Backside Power Delivery Networks (BSPDN) is is my post I wrote a few months ago about the bold bets Intel is making there. The big takeaway is that BSPDN is clearly going to be inserted in the design processes, and there is a small roadmap of improvements afforded by BSPDN. But after that, BSPDN will change the design process to allow adding more features, like moving functions on to the backside of the chip. By splitting the signal and power layers, there’s a whole new set of ideas of how to design chips with the space afforded from the power layers. This is Design Technology Co-optimization (DTCO) and System Technology Co-optimization (STCO) at it’s best. BSPDN looks like it has several years of obvious scaling potential, so it will be a huge part of the incremental semiconductor process from here until 2030. It will not only improve the energy delivered to the chip, but actually shrink the cell size. Think about it like a new way to organize the room, and now we can fit more in less even though its the same room filled with the same objects. Next, the roadmap in the long term after we have fully achieved backside power contact networks means we could open up the wafer on the other side of the chip. If we are opening up the other side to be a functional signal layer, there’s a potential we can start adding backside devices to the chip! This blew my mind, and the options for stacking layer, memory, and other devices (like energy capacitors) is endless! This is huge! – BSPDN is a key part of Intel’s technology roadmap. BSPDN is a mix of process lithography and logic technology to decouple the power grid from the design.

The proposed technique delivers power from the backside of a thinned device wafer, which allows for greater wafer sizes in terms of the amount of logic in a chip

Business

Jeep-Maker Stellantis Is Laying Off 1,350 Workers, Blaming EVs | Business Insider – interesting and complex picture being painted. In general, electric cars have less parts for assembly than their internal combustion engine powered equivalent cars. The costs must be coming in component costs and or research and development

China

Fashion factory: Mango brings production closer to home in rethink on China | Financial Times – “In this debate about whether 30 years of globalisation will continue or go backwards, the most important thing for us to follow in detail is the China issue,” he said. Asked if Mango would reduce the proportion it buys from the country, Ruiz replied: “I would say yes, but we’ll be very alert to how things evolve.” Mango gains some freedom from the fact it has only six stores in mainland China and consumers there contribute little to total sales, which it predicts will this year surpass its 2019 record of €2.4bn. Other brands have already moved more decisively. The US jeans maker Levi’s and UK bootmaker Dr Martens have been reducing their sourcing from China since before the pandemic.